应用于MEMS压力传感器的焊料键合可靠性分析OA
Analysis of Solder Bonding Reliability Applied to MEMS Pressure Sensors
针对MEMS压力传感器芯片对键合的高可靠性需求,设计了一种基于金属共晶键合原理的SnAgCu焊料键合工艺.论文对传感器芯片的金属过渡层、制备流程以及键合流程进行设计并完成芯片制备.为了研究焊料键合的可靠性,通过键合界面、剪切强度、热循环可靠性以及电学性能等实验进行分析.结果表明,其平均剪切力为100.80 N,满足GJB548B-2005的要求;经过热循环试验后,剪切强度几乎不变;经过键合后,传感器芯片的电阻变化率极小.综上可知,SnAgCu焊料键合具有良好的可靠性,可为MEMS压力传感器的键合封装提供参考.
To meet the high reliability requirements for bonding in MEMS pressure sensor chips,a SnAgCu solder bonding process based on the metal eutectic bonding principle is designed.This article presents the design of the metal transition layer,prep-aration procedures,and bonding process for the sensor chip,followed by the completion of chip preparation.To investigate the reli-ability of the solder bonding,this paper conducts experiments to analyze the bonding interface,shear strength,thermal cycle reli-ability,and electrical performance.The results indicate that the average shear force is 100.80 N,meeting the requirements of GJB548B-2005.Furthermore,after undergoing thermal cycle testing,the shear strength remains virtually unchanged.Additionally,the resistance change rate of the sensor chip is minimal after bonding.In conclusion,SnAgCu solder bonding exhibits excellent reli-ability,providing a valuable reference for the bonding and packaging of MEMS pressure sensors.
范慧榕;王俊强;李鹏程;高经武
中北大学仪器与电子学院 太原 030051||中北大学前沿交叉科学研究院 太原 030051中北大学仪器与电子学院 太原 030051||中北大学前沿交叉科学研究院 太原 030051中北大学仪器与电子学院 太原 030051中北大学前沿交叉科学研究院 太原 030051
信息技术与安全科学
压力传感器焊料键合可靠性分析MEMS
pressure sensorsolder bondingreliability analysisMEMS
《舰船电子工程》 2026 (1)
129-133,5
山西省基础研究计划自然科学研究面上项目(编号:202203021221105)资助.
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