金属化薄膜电容器电热耦合仿真与温升影响因素研究OA
Study on electro-thermal coupling simulation and temperature rise influencing factors of metallized film capacitors
金属化薄膜电容器在新能源发电系统逆变器、特高压直流输电换流阀站、电动汽车控制器及电磁能武器脉冲功率电源中具有广泛应用,其在运行过程中产生的温升问题对器件服役可靠性与使用寿命影响显著.为了研究金属化膜电容器温升的影响因素,以新能源汽车母线直流支撑电容器作为研究对象,建立基于COMSOL多物理场的金属化薄膜电容器电热耦合仿真模型,研究不同工况、材料参数及电容器结构对电容器温升的影响.结果表明,纹波电流、等效串联电阻、环境温度对电容器的温度分布和整体温升均有影响.提出基于高导热系数封装材料的电容器温升抑制方法,并仿真验证了该方法的可行性.研究结果为金属化薄膜电容器的结构优化设计与温升抑制提供了理论参考.
Metallized film capacitors are widely used in inverters for new energy power generation systems,ultra-high voltage direct current converter stations,electric vehicle controllers,and pulsed power equipments for electromagnetic energy weapons.The temperature rise issue during operation directly affects their service reliability and lifespan.To investigate the influencing factors of temperature rise in metallized film capacitors,this study took the DC-link support capacitor for new energy vehicles as the research object and established a thermoelectric coupling simulation model based on the COMSOL Multiphysics platform.The effects of different operating conditions,material parameters and capacitor structures on the temperature rise of capacitors were simulated.The results indicated that the ripple current,equivalent series resistance(ESR),and ambient temperature all exerted significant impacts on the temperature distribution and overall temperature rise of the capacitor.This study provides a method to reduce the capacitor's temperature rise by utilizing the high thermal conductivity of packaging materials.These findings provide a reference for the structural optimization design and temperature rise suppression of metallized film capacitors.
张天栋;毛林豹;殷超;迟庆国
哈尔滨理工大学 电气与电子工程学院,黑龙江 哈尔滨 150080||高效能特种电缆技术全国重点实验室,黑龙江 哈尔滨 150080||工程电介质及其应用教育部重点实验室,黑龙江 哈尔滨 150080哈尔滨理工大学 电气与电子工程学院,黑龙江 哈尔滨 150080哈尔滨理工大学 电气与电子工程学院,黑龙江 哈尔滨 150080||高效能特种电缆技术全国重点实验室,黑龙江 哈尔滨 150080||工程电介质及其应用教育部重点实验室,黑龙江 哈尔滨 150080哈尔滨理工大学 电气与电子工程学院,黑龙江 哈尔滨 150080||高效能特种电缆技术全国重点实验室,黑龙江 哈尔滨 150080||工程电介质及其应用教育部重点实验室,黑龙江 哈尔滨 150080
金属化薄膜电容器COMSOL Multiphysics电热耦合温升
metallized film capacitorCOMSOL multiphysicselectro-thermal couplingtemperature rise
《电子元件与材料》 2026 (3)
357-364,8
智能电网国家科技重大专项(2030)资助(2025ZD0808600)
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