基于AFD的MCM互连可靠性有限元分析OA

In order to analyze the interconnect reliability ofthe multi-chip module(MCM),a three-dimensional model composed of two Si switch chips and two GaAs low-noise amplifiers was constructed using ANSYS Parametric Design Language(APDL).Based on the Atomic Flux Divergence(AFD)theory and combined with Finite Element Analysis(FEA),point-coupled transient simulation analysis of the MCM was conducted to evaluate the interconnect reliability of the MCM under AC operating conditions and different thermal stresses.Interconnect reliability prediction under different current,line width and temperature conditions was achieved.This interconnect reliability analysis performed considering both transient thermal states and AC operating states for integrated circuits(ICs)simultaneously.The method can be used to guide layout design and improve the reliability and lifetime of MCM chips.