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高端芯片国产化突破路径研究OA

Breakthrough Pathways for High-end Chips Localization

中文摘要英文摘要

新质生产力是以科技创新为核心驱动力、具备高端化与智能化特征的新型生产力形态.高端芯片作为其关键载体,直接影响人工智能、量子计算等前沿技术的突破.在中美技术博弈背景下,我国高端芯片产业正面临核心技术代差、产业链协同不足与生态壁垒等结构性挑战.在梳理全球竞争格局与技术现状的基础上,系统分析国产化进程中的"卡脖子"环节,提出"政策-技术-生态-人才"四维联动的突破路径,为提升国产高端芯片自主可控能力提供理论支撑.

New quality productive forces refer to a new form of productivity driven by scientific and technological innovation and characterized by high-end and intelligent development.As a key technological carrier,high-end chips directly impact break-throughs in frontier technologies such as artificial intelligence and quantum computing.In the context of intensifying technological competition between China and the United States,China's high-end chip industry is facing a number of structural challenges,in-cluding technology generation gaps,weak coordination within the industrial chain,and constraints in the innovation ecosystem.Based on a review of the global competitive landscape and the current technological situation,this study analyzes the main bottle-necks restricting the domestic development of high-end chips.On this basis,a break-through path is proposed from four aspects:policy,technology,ecosystem,and talent.The aim is to provide theoretical support for enhancing the autonomy and controllability of China's high-end chip industry.

张倩

北京市科学技术研究院(北京 100089)

社会科学

科技创新高端芯片挑战国产化路径

Technological InnovationHigh-end ChipsChallengesLocalizationPathways

《科技广场》 2026 (1)

5-16,12

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