双掩膜硅-玻璃键合不等高工艺实现低电压小尺寸MEMS微镜OA

Electrostatically actuated micromirrors based on silicon-on-insulator(SOI)technology com-monly face challenges such as complex fabrication processes,high manufacturing costs,and limited design flexibility.To address these issues,a miniaturized electrostatically actuated MEMS micromirror based on a silicon-glass bonding(SOG)unequal-height process is proposed.A double-layer mask combined with stepwise etching is employed to form a vertical comb structure with a height difference,enabling effective vertical electrostatic actuation.The fabricated micromirror chip measures only 1.7 mm×1.7 mm,with a mirror diameter of 0.82 mm and a thickness of 450 μm,demonstrating a compact structure and good pro-cess compatibility.Experimental results indicate that a mechanical deflection angle of 0.52° can be achieved at a driving voltage of 10 V,with a response time of approximately 14 ms.These results demon-strate that the silicon-glass bonding unequal-height process can significantly simplify the fabrication proce-dure and reduce manufacturing costs while maintaining reliable device performance,providing a promising technical solution for optical communication systems with stringent requirements on power consumption and device size.