Cu/Ni复合涂层霉菌腐蚀行为影响OA

The continuous proliferation of electromagnetic wave applications in intelligent communication systems and microelectronics has driven the development of electromagnetic interference(EMI)shielding materials toward lightweight architectures,broadband absorption and high-efficiency shielding performance.Carbon fiber reinforced polymer(CFRP),as a high-performance substrate,has garnered significant attention due to its exceptional electrical conductivity,mechanical strength and low density.However,its inherent diamagnetic properties substantially limit magnetic loss capabilities,and it is usually necessary to prepare metal coatings on the surface to improve their electromagnetic shielding effectiveness.The work aims to explore the corrosion behavior of single-layer Cu and multi-layer Cu/Ni coatings(Cu,Cu/Ni,Cu/Ni/Cu and Cu/Ni/Cu/Ni)by mold and to study the corrosion process of Cu/Ni composite coatings under the action of mold.Firstly,Cu/Ni composite coatings(Cu,Cu/Ni,Cu/Ni/Cu and Cu/Ni/Cu/Ni)were prepared on the carbon fiber composite(CFRP)substrate by electroless plating and electroplating.Then,the prepared mixed spore suspension of mold(Aspergillus niger,Aspergillus flavus,Aspergillus versicolor,Penicillium funiculosum and Chaetomium globosum)was uniformly sprayed on the surface of the sample for constant temperature and humidity experiments.Finally,the corrosion morphology and mold growth of the samples were observed by scanning electron microscope(SEM)after different experimental cycles,and the local element analysis was carried out by energy dispersive spectrometer(EDS).The surface chemical state of the samples was analyzed by X-ray photoelectron spectroscopy.After 28 days of the experiment,a large number of white colonies were observed on the surface of Cu and Cu/Ni/Cu coating samples.The number of molds was large and there were obvious cracks and pitting pits.The surface was covered by corrosion products and serious corrosion occurred.However,the number of molds on the surface of Cu/Ni and Cu/Ni/Cu/Ni coating samples was small,and no obvious corrosion occurred.The surface of the coating was intact,and only the surface of Cu/Ni coating had sporadic green corrosion products.Compared with Cu and Cu/Ni/Cu coatings,the samples of Ni coating on the surface did not suffer from large-area corrosion and the surface of the coating sample was relatively flat,without obvious cracks and holes.The corrosion results of the coating were related to the layered structure of the coating.The Cu and Cu/Ni/Cu coating samples were susceptible to mold corrosion,but as the corrosion reaction progressed,the copper ions continuously released by the Cu coating inhibited the activity of the mold and reduced the number of the mold.After the 28 d corrosion experiment,the corrosion degree of the two was close.The Cu/Ni and Cu/Ni/Cu/Ni coating samples effectively reduced the adhesion of the mold on the coating surface.At the same time,the passivation film formed during the corrosion process acted as a barrier to the corrosive medium and alleviated the corrosion rate of the mold to the coating.The Cu/Ni/Cu/Ni multi-layer structure could more effectively reduce defects such as pores,making its corrosion degree lower than that of the Cu/Ni coating.These findings provide critical insights for developing advanced protective coatings that combine the antimicrobial properties of copper with the passivation capabilities of nickel in optimized multi-layer architectures.