石墨烯增强铜基复合材料的微尺度力学性能研究OA
A Study on Micromechanical Properties of Graphene Reinforced Copper Composites
本文利用放电等离子烧结技术(Spark Plasma Sintering,SPS)制备了石墨烯增强铜基复合材料.采用X射线衍射(X-Ray Diffraction,XRD),拉曼光谱(Raman Spectrum,Raman)、扫描电镜(Scanning Electron Microscope,SEM)及仪器化微米压入技术分别研究了复合材料的显微组织和力学性能(如硬度、弹性模量和屈服强度).研究结果表明,石墨烯能够保持复合材料的原有结构且较均匀地分布于复合材料中,复合材料的晶粒得到了明显细化;当石墨烯添加量为 1.5wt.%时,复合材料的弹性模量和屈服强度分别增加了约 36%和 41%.随着石墨烯含量的增加,晶粒并没有进一步细化,且复合材料中石墨烯的间距保持在微米级,晶粒细化作用和奥罗万机制在本研究中并不显著.分析发现,石墨烯和铜的热膨胀系数间的较大差异引起的热失配残余应力导致的位错密度增加可能是本研究中铜基复合材料的主要增强机制.
Graphene-reinforced copper matrix composites were fabricated by spark plasma sintering(SPS).The microstructure and mechanical properties(e.g.,hardness,elastic modulus,and yield strength)of the composites were investigated by using X-ray diffraction(XRD),Raman spectroscopy,scanning electron microscopy(SEM),and instrumented micro-indentation technique.The results show that graphene retains its pristine structure and is uniformly distributed in the composites,leading to significant grain refinement.With the addition of 1.5wt.%graphene,the elastic modulus and yield strength of the composites increase by about 36%and 41%,respectively.Further analysis reveals that the grain size does not further refine with increasing graphene content,and the inter-particle spacing of graphene remains at the micron level.Therefore,grain refinement and Orowan strengthening are not significant in this study.The increased dislocation density caused by thermal mismatch residual stress due to the large difference in thermal expansion coefficients between graphene and copper may be the dominant strengthening mechanism for the copper matrix composites.
宋英;徐勇;胡定烁;蒋靖;王伟
苏州工学院 机械工程学院,江苏 常熟 215500苏州工学院 机械工程学院,江苏 常熟 215500苏州工学院 机械工程学院,江苏 常熟 215500苏州工学院 机械工程学院,江苏 常熟 215500苏州工学院 机械工程学院,江苏 常熟 215500||盐城工学院 机械工程学院,江苏 盐城 224001
矿业与冶金
石墨烯铜基复合材料力学性能仪器化压入增强机制
graphenecopper matrix compositesmechanical propertiesinstrumented indentationstrengthening mechanisms
《苏州工学院学报》 2026 (2)
16-22,7
江苏省高等学校自然科学研究面上项目"激光粉末床熔融Ni-MXene增强铜基复合材料成形机理及性能研究"(KYZ2022033Z)中国博士后科学基金面上项目(2023M732566)
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