横向多芯片组件传热性能优化设计OA

As chip power and chip density increase,the heat generation of multi-chip module(MCM)technology becomes larger and larger.Therefore,heat transfer analysis for multi-chip modules becomes very important.This paper takes 2×2 multi-chip LED modules as the research object to study the influence of chip layout and packaging parameters on chip junction temperature.The best chip layout method and the most economical packaging parameters are explored.It is concluded that increasing the substrate thermal conductivity,substrate thermal conductivity and substrate bottom equivalent convective heat transfer coefficient are all conducive to reducing chip junction temperature,and the substrate bottom equivalent convective heat transfer coefficient is the main factor affecting chip junction temperature.Finally,the best packaging parameters were used to compare the junction temperature of the MCM-LED chip before and after overall optimization.It was concluded that the junction temperature of the optimized chip was significantly reduced,with the maximum decrease of 37.48%.