高热流密度均温板强化散热技术OA

In response to the challenges posed by the increasing heat flux density due to the miniaturization and high integration of electronic systems,the vapor chamber,as a novel type of heat pipe,has demonstrated unique advantages with its exceptional thermal conductivity,excellent temperature uniformity,and compact spatial volume.This paper provides a review of the research on enhanced heat dissipation of high heat flux density vapor chambers with heat flux density≥50W/cm²,summarizing the fabrication of wick cores,vapor chamber structures,and numerical simulations.Based on previous studies,suggestions are provided for the design of vapor chambers under different environmental conditions with high heat flux density.This paper offers new perspectives and strategies for the thermal management of electronic components to address the growing demand for thermal management.