三维集成锥形TGV互连结构信号传输性能分析与优化OA

A through-glass via(TGV)is an important vertical interconnection structure in three-dimensional integrated circuits.An electromagnetic simulation model of TGV was established based on the High Frequency Structure Simulator(HFSS)software,and the effects of signal frequency,maximum diameter of through hole,height of through hole and minimum diameter of through hole on the return loss(S11)were analyzed.The response surface method was used to design 17 groups of experimental simulation calculations,and a fitting model of TGV structural parameters and return loss S11 was obtained.The model was then optimized using the genetic algorithm and the results were finally validated.The results show that the S11 of TGV decreases with the increase of signal frequency in the range of 1-10 GHz.The S11 parameter decreases with the increase of the maximum diameter,height and minimum diameter of the through hole.The order of the influence degree of TGV structural parameters on S11 is as follows:via height>maximum via diameter>minimum via diameter.The optimal parameter combination of TGV is as follows:the maximum diameter of the through hole is 70 μm,the height of the through hole is 400 μm,and the minimum diameter of the through hole is 40 μm.Compared with the baseline model,the S11 of the TGV with the optimal parameter combination is reduced by nearly 18.87％,thus achieving the structural optimization of the conical TGV.