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集成异质结二极管的4H-SiC半超结MOSFETOA

A 4H-SiC semi-superjunction MOSFET with an integrated heterojunction diode

中文摘要英文摘要

为改善碳化硅(SiC)超结MOSFET体二极管的反向恢复特性并降低开关损耗,提出一种集成异质结二极管的超结MOSFET(SJH-MOSFET)新结构.该结构在栅槽底部引入与源极短接的P+多晶硅,与 4H-SiC漂移区构成异质结续流二极管;同时增设P+屏蔽层并采用半超结设计以优化电场.基于TCAD的仿真对比分析表明,相较于传统双沟槽结构,新器件的击穿电压提升 18.4%至 1710 V,比导通电阻降低 12.1%至 1.45 mΩ·cm2.异质结二极管有效抑制了少子注入,使反向恢复电荷降低 60.9%;减小的栅-漏耦合面积则使米勒平台电荷降低 79.2%,总开关损耗减少 40.4%.该研究为同时优化动态特性与可靠性的高性能SiC功率器件设计提供了有效途径.

A novel superjunction MOSFET with an integrated heterojunction diode(SJH-MOSFET)was proposed to enhance the reverse recovery performance of the body diode and reduce switching losses in silicon carbide(SiC)superjunction MOSFETs.The structure incorporated a source-shorted P+polysilicon at the trench bottom,which formed a heterojunction with the 4H-SiC drift region to function as the body diode.In addition,a P+shielding layer and a semi-superjunction design were incorporated to optimize the electric field distribution.TCAD simulations comparing the proposed device with a conventional double-trench MOSFET demonstrated that it achieved a breakdown voltage of 1710 V and a specific on-resistance of 1.45 mΩ·cm2,corresponding to an 18.4%increase in breakdown voltage and a 12.1%reduction in specific on-resistance,respectively.The heterojunction diode effectively suppressed minority carrier injection,reducing the reverse recovery charge by 60.9%.By shrinking the effective gate-drain coupling area,the proposed device reduced the Miller plateau charge by 79.2%,resulting in a 40.4%reduction in total switching loss.This work provides a viable design route for high-performance SiC power devices that simultaneously improve dynamic performance and reliability.

张闯;张腾;黄润华;李士颜;柏松

南京电子器件研究所 宽禁带半导体器件与集成技术全国重点实验室,江苏 南京 210016南京电子器件研究所 宽禁带半导体器件与集成技术全国重点实验室,江苏 南京 210016南京电子器件研究所 宽禁带半导体器件与集成技术全国重点实验室,江苏 南京 210016南京电子器件研究所 宽禁带半导体器件与集成技术全国重点实验室,江苏 南京 210016南京电子器件研究所 宽禁带半导体器件与集成技术全国重点实验室,江苏 南京 210016

信息技术与安全科学

4H-SiC MOSFET超结异质结反向恢复特性

4H-SiC MOSFETsuperjunctionheterojunctionreverse recovery characteristic

《电子元件与材料》 2026 (2)

150-156,7

江苏省自然科学基金(BK20220212)江苏省科技攻关计划(BG2024001)江苏省科技攻关计划(BE2022048-1)

10.14106/j.cnki.1001-2028.2026.1514

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