Advances in waveguide to waveguide couplers for 3D integrated photonic packagingOA
Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
Drew Weninger;Samuel Serna;Luigi Ranno;Lionel Kimerling;Anuradha Agarwal
Materials Research Laboratory,Massachusetts Institute of Technology,77 Massachusetts Ave,Cambridge 02139 MA,USA||Physical Measurement Laboratory,National Institute of Standards and Technology,100 Bureau Dr,Gaithersburg 20899 MD,USADepartment of Physics,Photonics,and Optical Engineering,Bridgewater State University,131 Summer St,Bridgewater 02324 MA,USADepartment of Materials Science and Engineering,Massachusetts Institute of Technology,77 Massachusetts Ave,Cambridge 02139 MA,USA||Ayar Labs,695 River Oaks Pkwy,San Jose 95134 CA,USADepartment of Materials Science and Engineering,Massachusetts Institute of Technology,77 Massachusetts Ave,Cambridge 02139 MA,USAMaterials Research Laboratory,Massachusetts Institute of Technology,77 Massachusetts Ave,Cambridge 02139 MA,USA
《光：科学与应用（英文版）》 2026 (1)
70-118,49
This work was supported by NSF Convergence Accelerator Track I:FUTUR-IC:A Resource-Efficient Microchip Manufacturing and Operations Research Alliance,Award Number ITE-2345076.
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