高功率大面积AI芯片液冷技术进展OA
Research Progress on Liquid Cooling Technologies for High-Power and Large-Area AI Chips
随着人工智能(artificial intelligence,AI)技术的升级迭代,巨大的算力需求推动了AI芯片的发展,特别是近年来开发的芯粒(Chiplet)技术,为人工智能提供了高计算性能、高良品率、低成本的先进芯片封装集成方案,为AI发展提供了坚实的硬件支撑.Chiplet型芯片具有大面积、高发热功率的特征,其3D的芯片堆叠设计带来了热流分布不均匀、多层芯片导热路径长、填充热界面材料较厚等散热难题,成为了芯片性能提升的关键瓶颈,Chiplet型芯片的高效热管理成了人工智能发展的关键挑战.本文综述了芯片热管理的先进液冷技术进展,包括单相与两相液冷方案,基于冷却架构分为冷板式液冷、近结区液冷与浸没式液冷,并针对2.5D、3D Chiplet型芯片中的散热问题与冷却方案进行了总结,为高功率大面积AI芯片的液冷方案的应用与发展提供参考.
With advances in artificial intelligence(AI),massive computing demands have driven the development of AI chips.In particular,the recently proposed chiplet technology provides an advanced chip packaging and integration solution that offers high computing performance at a high yield rate and low cost,thus delivering solid hardware support for AI development.Chiplet-based chips are characterized by large area and high heat power,and their 3D chip stacking design leads to cooling challenges such as non-uniform heat flux distribution,long heat conduction paths for multilayer chips,and relatively thick thermal interface materials.These thermal issues are key bottlenecks limiting chip performance,making efficient chiplet thermal management a critical challenge in AI development.The progress in advanced liquid cooling technologies,including single-and two-phase liquid cooling solutions,is reviewed.Based on the cooling architecture,liquid cooling solutions can be categorized as cold-plate,near-junction-region,and immersion liquid cooling.In addition,the heat dissipation challenges and cooling strategies in 2.5D and 3D chiplets are summarized,providing a reference for the application and development of liquid cooling technologies for high-power,large-area AI chips.
邹启凡;刘洪;罗海亮;杨荣贵
华中科技大学能源与动力工程学院 武汉 430074||北京大学力学与工程科学学院能源与资源工程系 北京 100871中国移动通信集团设计院有限公司 北京 100080中国移动通信集团设计院有限公司 北京 100080华中科技大学能源与动力工程学院 武汉 430074||中国移动通信集团设计院有限公司 北京 100080||北京大学力学与工程科学学院能源与资源工程系 北京 100871
能源科技
人工智能Chiplet技术芯片热管理单相液冷两相液冷
artificial intelligenceChipletchip thermal managementsingle-phase liquid coolingtwo-phase liquid cooling
《制冷学报》 2026 (1)
20-36,17
国家自然科学基金(T2588301&52036002)资助项目.(The project was supported by the National Natural Science Foundation of China(No.T2588301&No.52036002).)本文受北京市自然科学基金联合重点项目(L257012)资助.(The project was supported by the Beijing Municipal Natural Science Foundation (No. L257012). )
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