中频可重构收发SiP电路设计OA

Intermediate frequency circuits play an indispensable role in high-sensitivity and high-performance RF systems.At present,SiP technology mainly focuses on the high-density integration of 3D packages,and pays more attention to product miniaturisation,lightweight design,and batch production,integrating the circuits into a complete system,which inevitably leads to longer R&D cycles and more complex processes.Integrating the characteristics of SiP technology and IF transceiver circuits,this paper proposed a rapidly verifiable IF reconfigurable SiP circuit,which has the advantages of high reliability,lower cost,shorter development cycle,flexible size and easy integration,and is suitable for miniaturisation of circuits or rapid verification of new circuits in small quantities and lower cost.We developed a product based on analysis and simulation results.We compared the gain data of the 30 products with each other,and the test data showed that the consistency and stability of SiP in this architecture can meet the needs of mass production.At present,this IF SiP has been applied to engineering,and we plan to adopt a similar design in the X-band in the future to study the applicability of bonding matching in the X-band.