基于SiP技术的超宽带多通道T/R组件设计OA

To meet the urgent requirements for miniaturization,high integration,and multi-functionality of T/R modules in active phased array systems,System-in-Package(SiP)technology was adopted to integrate multiple chips with diverse functions onto a silicon substrate.Through a three-dimensional stacking design,miniaturized high-power transceiver and frequency-selection microsystem components were successfully realized.By integrating these two types of microsystem components and peripheral circuits on the substrate,a compact ultra-wideband reconfigurable T/R module with 8 receive and 4 transmit channels was developed.The receiving frequency range of the fabricated module spans from 0.3 GHz to 3 GHz,with a noise figure of less than 3.4 dB.Its maximum receiving gain is better than 40.2 dB and can be controlled via a 6-bit digital attenuator.Over the frequency range of 0.9-1.5 GHz,the T/R module provides a pulse power of more than 45.8 dBm and a gain of more than 60.9 dB,while the fluctuation of transmitting power and gain across multiple channels is less than 0.4 dB.The module has a size of 180 mm×106 mm×12 mm,which represents an approximately 36.4%reduction in size compared to traditional T/R modules with similar functions.The excellent performance of the fabricated module proves that the proposed method provides a valuable reference for the design of highly integrated T/R modules.