光伏硅片切割技术研究进展OA

Taking the photovoltaic silicon wafer cutting technology as the research object,through literature review and comparative analysis,the main types of cutting technologies such as outer circle cutting,inner circle cutting,multi-wire cutting,electrical discharge cutting and compound cutting are introduced in detail,and their advantages and disadvantages are compared from multiple dimensions such as cutting accuracy,cutting loss and cutting efficiency.The research conclusion indicates that the multi-wire cutting technology has become the mainstream method for silicon wafer cutting and processing due to its high economic benefits,ability to cut large-sized silicon ingots,and shallow crystal defect depth.The composite cutting technology is expected to be the future development trend with its advantages of high cutting efficiency,high customizability,and low loss.