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ZYNQ系列FPGA片内XADC的温度检测自适应分段补偿OA

Adaptive Segmented Compensation for Temperature Detection of on-Chip XADC in ZYNQ Series FPGAs

中文摘要英文摘要

研究现场可编程门阵列(FPGA)片内赛灵思模数转换器(XADC)的温度检测技术对芯片过热保护与预警系统的可靠性提升具有重要意义.针对传统FPGA内部全温区线性补偿方法在高低温环境下检测误差大、预警响应滞后等问题,提出一种高低温环境下自适应分段补偿方法.该方法在-10~30 ℃温度区间内采用默认线性补偿;而在低于-10 ℃或高于30 ℃的温度下则启用非线性补偿.整个补偿过程在ZYNQ系列FPGA芯片的处理系统(PS)端处理温度数据,充分发挥其处理速度快且避免占用可编程逻辑(PL)端资源的优势.通过构建PS端与PL端协同预警系统架构能及时有效触发预警,证明了自适应分段补偿方法的可靠性与实用性.

Research on the temperature detection technology of on-chip Xilinx analog-to-digital converter(XADC)in field-programmable gate array(FPGA)is of great significance for improving the reliability of chip overheating protection and early warning systems.Aiming at the problems of large detection errors and delayed early warning responses in the traditional full-temperature-range linear compensation method inside FPGAs under high and low temperature environments,an adaptive segmented compensation method for high-and low-temperature environments is proposed.Default linear compensation is adopted in the temperature range from-10 ℃ to 30 ℃,while nonlinear compensation is activated when the temperature is below-10 ℃or above 30 ℃.Temperature data during the entire compensation process is processed on the processing system(PS)side of ZYNQ-series FPGA chips,and the advantages of high processing speed and no occupation of programmable logic(PL)side resources are fully leveraged.A collaborative early warning system architecture between the PS and PL sides is constructed,which is triggered timely and effectively,thereby demonstrating the reliability and practicability of the adaptive segmented compensation method.

盛沨;于治;谢文虎;谢达

无锡中微亿芯有限公司,江苏无锡 214072无锡中微亿芯有限公司,江苏无锡 214072无锡中微亿芯有限公司,江苏无锡 214072无锡中微亿芯有限公司,江苏无锡 214072

信息技术与安全科学

FPGAXADC温度检测分段补偿预警

FPGAXADCtemperature detectionsegmented compensationearly warning

《电子与封装》 2026 (1)

62-67,6

国家重点研发计划(2024YFB4505402)江苏省科技重大专项(BG2024032)江苏省基础研究计划(BK20243020)

10.16257/j.cnki.1681-1070.2026.0009

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