低温银烧结技术的可靠性研究进展OA

With the rapid development of high-power electronic technology,the operating temperature of chips continues to rise.Sintered micro-and nano-silver,due to their excellent conductivity,thermal conductivity,and mechanical strength,have become one of the most promising high-temperature packaging interconnect materials.However,the reliability of sintered silver joints under long-term high-temperature environments and frequent switching conditions has not been fully validated.By reviewing the reliability research on sintered silver joints in high-temperature aging,thermal cycling,thermal shock and power cycling tests,the material and process reliability of low-temperature silver sintering technology is systematically summarized,and the two key mechanisms leading to joint degradation are deeply analyzed:the thermal driving force effect and thermal stress impact.Through analysis,the current key technical challenges are summarized,and effective strategies to improve the reliability of sintered silver joints are explored.