半导体先进封装领域专利技术综述OA
Review on Patent Technologies in the Field of Advanced Semiconductor Packaging
随着AI、高性能计算等产业的快速发展,先进封装技术成为延续摩尔定律的重要技术路径之一.聚焦2.5D与3D封装技术,系统梳理以封装结构、中介层、基板为核心的专利技术体系,剖析典型专利的创新点、技术优势及市场应用价值,揭示半导体封装测试领域的专利布局策略与产业竞争态势,为相关企业的技术研发与专利布局提供参考.
With the vigorous development of industries such as AI and high-performance computing,advanced packaging technology is now regarded as a crucial pathway for extending Moore's Law.2.5D and 3D packaging technologies are focused.The patent technology systems centered on packaging structures,interposers,and substrates are systematically reviewed.Furthermore,the innovation points,technical advantages,and market application values of typical patents are analyzed.The patent layout strategies and industrial competition landscape in the field of semiconductor packaging and testing are also revealed.Accordingly,guidance is provided for relevant enterprises in technology research and development as well as patent layout.
余佳;马晓波
湖南越摩先进半导体有限公司,湖南株洲 412000湖南越摩先进半导体有限公司,湖南株洲 412000
信息技术与安全科学
半导体封装测试2.5D封装3D封装专利技术异构集成
semiconductor packaging and testing2.5D packaging3D packagingpatent technologyheterogeneous integration
《电子与封装》 2026 (1)
22-29,8
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