SiCp/Cu基复合材料性能提升与界面调控优化的研究进展OA

With the continuous improvement of comprehensive performance of materials requirements in fields such as advanced manufacturing,electronic packaging,and thermal management,traditional copper and its alloys are increasingly facing limitations in strength,wear resistance,and electrical and thermal conductivity.Silicon carbide particle-reinforced copper matrix composites(SiCp/Cu)have attracted exten-sive attention due to their excellent mechanical,electrical,and thermal properties.This paper provides a systematic review of the performance enhancement mechanisms of SiCp/Cu composites in terms of wear re-sistance,electrical conductivity,thermal conductivity,and corrosion resistance,focusing on the optimiza-tion of compositional design parameters such as SiC particle size,content,and distribution.Moreover,the interfacial control strategies through Cu matrix microalloying and surface modification of SiC particles,as well as the concept of multiphase synergistic reinforcement,are discussed.This study aims to provide a valuable reference for the design and development of high-performance SiCp/Cu matrix composites.