A new flat electronics cooling device composed of internal parallel loop heat pipesOA
A new flat electronics cooling device composed of internal parallel loop heat pipes
Larissa Krambeck;Kelvin Guessi Domiciano;Marcia B.H.Mantelli
Heat Pipe Laboratory,Department of Mechanical Engineering,Federal University of Santa Catarina,Florianopolis/SC 88040-900,BrazilHeat Pipe Laboratory,Department of Mechanical Engineering,Federal University of Santa Catarina,Florianopolis/SC 88040-900,BrazilHeat Pipe Laboratory,Department of Mechanical Engineering,Federal University of Santa Catarina,Florianopolis/SC 88040-900,Brazil
two-phase deviceloop heat pipe(LHP)parallel arrangementpulsating heat pipe(PHP)diffusion bondingelectronics cooling
two-phase deviceloop heat pipe(LHP)parallel arrangementpulsating heat pipe(PHP)diffusion bondingelectronics cooling
《实验与计算多相流（英文）》 2024 (3)
277-286,10
The authors acknowledge the National Council for Scientific and Technological Development(CNPq),National Fund for Scientific and Technological Development(FNDCT),and Ministry of Science,Technology,and Innovations(MCTI)for project fundings 405784/2022-8 and 406451/2021-4 and a scholarship under grant number 381267/2023-7.The authors also acknowledge the Foundation for Research Support of Santa Catarina(FAPESC)for providing a scholarship under grant number 3003/2021.
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