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打印微结构对表面电荷积聚特性的影响OA北大核心CSTPCD

Influence of Printed Microstructures on Surface Charge Accumulation Characteristics

中文摘要英文摘要

航天器等真空设备面临着高电压、小型化的发展需求,但其中的固体-真空绝缘界面容易发生真空沿面闪络.为了提升真空绝缘的沿面耐电性能,通过3D打印技术在绝缘介质表面构建了微刻槽和打印金属两种微结构,并通过电荷积聚实验研究发现了打印微结构能有效抑制表面电荷积聚过程;同时,改变微刻槽数量以及金属的宽度和数量,进一步通过实验对比研究了参数不同时的情况,发现增加微结构的数量和宽度均有利于提升其对电荷积聚的抑制效果;最后,构建真空沿面闪络粒子仿真模型,通过研究电子运动和二次电子崩的发展,并结合实验结果发现微结构能够散射电子,从而产生抑制电荷积聚、提升沿面耐电强度的效果.

Spacecraft and other vacuum equipment are facing the development requirements of higher voltage grade and miniaturization,however,vacuum flashover is prone to occur along the solid-vacuum insulation interface.To improve electric strength along the surface,we have successfully built two microstructures,the microgrooves and the printed metal,on the dielectric surface through 3D printing technology.It is found that the printed microstructures can effectively sup-press the surface charge accumulation process through charge accumulation experimental studies.At the same time,the conditions of different microstructure parameters are further studied through experiments,including different number of microgrooves as well as different width and number of the printed metal wire.Increasing the number and width of micro-structures is found to be beneficial in enhancing their inhibitory effect on charge accumulation.Finally,a PIC simulation is conducted to study the electron movement and secondary electron avalanche development.In conjunction with the ex-perimental results,it is found that the microstructures are capable of scattering electrons,leading to the effects of inhibiting surface charge accumulation and enhancing electric strength along the surface.

姚亦桐;杨洋;牛广乾;钱志源;刘承山;穆海宝

西安交通大学电工材料电气绝缘全国重点实验室,西安 710049上海宇航系统工程研究所,上海 201109

真空沿面闪络;3D打印;打印微结构;电荷积聚;二次电子崩;耐电强度

vacuum flashover;3D printing technology;printed microstructure;surface charge accumulation;secondary electron avalanche;electric strength

《高电压技术》 2024 (005)

2237-2246 / 10

10.13336/j.1003-6520.hve.20230811

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